Description
The ABB 5SHX1445H0001 is a high-power Press-Pack IGBT (Insulated Gate Bipolar Transistor) module engineered for ultra-reliable power conversion in multi-megawatt industrial drives and energy infrastructure. As part of ABB’s HiPak series, this module utilizes advanced press-pack packaging technology to achieve double-sided cooling, enabling exceptional thermal management under extreme current loads up to 1,200A at 3.3kV/4.5kV blocking voltages. The 5SHX1445H0001 integrates multiple IGBT/diode pairs in a compact stackable design, serving as the core switching element in ABB ACS6000 medium-voltage drives, HVDC converters, and grid-scale renewable inverters. Its solder-free mechanical contact structure eliminates bond wire failure risks while providing low-inductance commutation paths. Optimized for high cycling capability and short-circuit ruggedness, the ABB 5SHX1445H0001 ensures mission-critical reliability in heavy industries where power density and operational continuity are paramount.

ABB 5SHX1445H0001 3BHL000391P0101 3BHB003230R0101 5SXE05-0152
Technical Specifications
| Parameter Name | Parameter Value |
| Product Model | 5SHX1445H0001 |
| Manufacturer | ABB |
| Product Type | Press-Pack IGBT Module |
| Voltage Rating (VCES) | 3.3 kV / 4.5 kV |
| Continuous Current (IC @ 80°C) | 1,200 A |
| Maximum Junction Temperature | 125°C |
| Switching Frequency Range | 50–500 Hz |
| Thermal Resistance (Rth(j-c)) | 0.015 K/W |
| Short-Circuit Withstand Time | 10 μs (typ.) |
| Module Weight | 3.8 kg |
| Cooling Method | Direct liquid cooling (double-sided) |
| Isolation Voltage (min.) | 6 kV AC |
| Terminal Type | Low-inductance press-fit contacts |
Main Features and Advantages
Uncompromising Power Density: The press-pack design eliminates traditional solder layers and bond wires, enabling direct double-sided cooling for 40% higher current density versus standard modules. This allows compact drive designs exceeding 1.5 MW/module in steel mill main drives and mining conveyors.
Ultra-Rugged Performance: Engineered to withstand >100,000 thermal cycles, the 5SHX1445H0001 excels in high-vibration environments. Its intrinsic short-circuit failure mode opens safely (non-explosive), critical for personnel safety in offshore wind converters.
Advanced Thermal Management: Low thermal resistance (0.015 K/W) and symmetrical cooling architecture maintain junction temperatures within limits even at 1.2 kA continuous load. Copper baseplates enable direct contact with cold plates for minimal thermal impedance.
System Integration: Seamless compatibility with ABB’s 3BHL000391P0101 gate driver unit ensures precise switching control and multi-level protection (VCE desaturation monitoring, soft shutdown). Press-fit terminals reduce assembly time by 70% versus bolted solutions.
Application Field
The ABB 5SHX1445H0001 dominates mission-critical power conversion:
Metals Industry: Drives 10,000+ HP rolling mill motors in steel plants, ensuring torque precision ≤±0.5% during reversing operations.
Mining: Powers hoists and conveyor drives in deep-pit mines, withstanding voltage spikes from regenerative braking.
Energy Infrastructure: Converts power in HVDC stations and wind turbine converters (>7 MW turbines), handling grid fault ride-through.
Marine Propulsion: Drives LNG carrier azimuth thrusters (20+ MW systems) with salt-spray corrosion resistance.
Cement/Pulp: Controls kiln drives and high-inertia crushers, optimized for high overload capacity.
Related Products
5SHY3545L0020: Higher-current variant (3.5 kA) for ultra-high-power traction drives.
3BHL000391P0101: Matched gate driver unit for 5SHX1445H0001 protection logic.
5SXE05-0152: Snubber capacitor for suppressing switching voltage spikes.
5SNG1145H3301: Diode clamp module for parallel operation.
3BHB003230R0101: Control interface board for ACS6000 DSU integration.
5SDF2565L0004: Press-pack thyristor for HVDC breaker applications.
5STP18N4200: IGCT module alternative for high-di/dt applications.

ABB 5SHX1445H0001 3BHL000391P0101 3BHB003230R0101 5SXE05-0152
Installation and Maintenance
Pre-installation preparation: Verify cooling plate flatness (<10>3BHL000391P0101 firmware matches drive system requirements.
Maintenance recommendations: Monitor junction temperature via driver diagnostics monthly. Replace cooling system O-rings annually to prevent leaks. Clean coolant paths every 20,000 operating hours. After 5+ years, conduct contact resistance measurement on power terminals. Never reuse press-fit contacts during module replacement.



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